Charging of silicon wafer surfaces by energetic plasma species is a serious concern as on-wafer structures and devices become smaller and more sensitive. The MKS
toroidal remote plasma source, when incorporated into a semiconductor process tool, delivers primarily neutral radical reactants to a wafer surface, with little to no potentially damaging charged species.
This white paper describes the experimental verification of that claim using an industry-standard wafer charging monitor. MKS Paragon® and R*evolution® Remote Plasma Sources were characterized using Ar, N2, O2, and H2 under typical process conditions.
Explore the experimental verification of the claim an MKS toroidal remote plasma source delivers primarily neutral radical reactants to a wafer surface, with little to no potentially damaging charged species.
